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Reliability of Indium Solder for Cold Temperature Packaging

[+] Author Affiliations
Rui Wu, F. Patrick McCluskey

University of Maryland, College Park, MD

Paper No. IPACK2007-33456, pp. 553-556; 4 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


A failure model has been developed for indium die attach fatigue in extreme cold temperature environment applications, such as distributed control systems for planetary exploration. The model contains both a stress component, which is based on the packaging structure, and a damage component, which is based solely on the material properties. The stress model is developed for a wire bonded, hermetic ceramic module containing a SiGe hetero-junction bipolar transistor intended for use in a lunar base. The model was calibrated using results from −196°C to 125°C thermal shock testing.

Copyright © 2007 by ASME



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