Full Content is available to subscribers

Subscribe/Learn More  >

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

[+] Author Affiliations
X. Long, I. Dutta, R. Guduru

Naval Postgraduate School, Monterey, CA

R. Prasanna, M. Pacheco

Intel Corporation, Chandler, AZ

Paper No. IPACK2007-33271, pp. 539-546; 8 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3


A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In