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Free Flexural (or Bending) Vibrations of Orthotropic Composite Mindlin Plates With a Bonded Non-Central (or Eccentric) Lap Joint

[+] Author Affiliations
U. Yuceoglu, Ö. Güvendik, V. Özerciyes

Middle East Technical University, Ankara, Turkey

Paper No. IMECE2003-43651, pp. 135-152; 18 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Recent Advances in Mechanics of Solids and Structures
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 0-7918-3726-2 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


The present study is concerned with the “Free Flexural (or bending) Vibrations of Orthotropic Composite Mindlin Plates with a Bonded Non-Central (or Eccentric) Lap Joint”. The Mindlin plate adherends or panels of dissimilar, orthotropic material are connected by an adhesively bonded non-central (or eccentric) single lap joint. The adhesive layer is considered to be relatively very thin and linearly elastic. The theoretical formulation is based on the combination of the full set of the dynamic plate equations and the adhesive layer stress-displacement equations. Eventually, the system of equations is reduced to a set of the first order governing ordinary differential equations in the “state vector” form. The governing system of the differential equations is numerically integrated by means of the “Modified Transfer Matrix Method (with Interpolation and/or Chebyshev Polynomials)”. The effect of the non-central (or eccentric) location of the bonded lap joint is investigated and presented in detail in terms of natural frequencies and the associated mode shapes. The significant effects of the “hard” or the “soft” adhesive layer constants on the mode shapes and the natural frequencies are also investigated. Some important parametric studies such as the influences of the “Joint Length Ratio”, the “Joint Position Ratio” and the “Bending Rigidity Ratio” on the natural frequencies are computed and presented for the “hard” and the “soft” adhesive cases.

Copyright © 2003 by ASME



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