0

Full Content is available to subscribers

Subscribe/Learn More  >

Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices

[+] Author Affiliations
Qiang Yu, Tadahiro Shibutani, Akifumi Tanaka, Takahiro Koyama, Masaki Shiratori

Yokohama National University, Yokohama, Kanagawa, Japan

Paper No. IPACK2007-33250, pp. 531-537; 7 pages
doi:10.1115/IPACK2007-33250
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

The changeover from eutectic Sn-Pb solder to lead-free solder (Sn-Ag-Cu) has been driven by environmental concerns in the last few years. In this study, in order to obtain the low-cycle fatigue characteristic of Sn-Ag-Cu lead-free solder joints, an isothermal mechanical fatigue test with a large strain range, which can clarify the crack generation process and shorten the examination time, was carried out. FEM analysis was also performed in order to evaluate the relationship between the inelastic strain range and the low-cycle fatigue life. As a result, compared with fatigue life longer than 1000 cycles, the scatter of the fatigue cycles from 100 to several hundred cycles becomes larger. So, it seems that it is necessary to carefully evaluate the low-cycle fatigue life in the reliability evaluation. Moreover, in large chip components, not only crack initiation, but also crack propagation, affects the failure life. Thus, the crack path was simulated and the failure cycle of the large chip was evaluated based on Miner’s rule, and reliability of including the fatigue crack propagation can be evaluated by the analytical approach.

Copyright © 2007 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In