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Characterization of 1st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

[+] Author Affiliations
Arun Madyala, Adam Huang

University of Arkansas, Fayetteville, AR

Paper No. IPACK2007-33871, pp. 509-513; 5 pages
doi:10.1115/IPACK2007-33871
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

We have developed the first MEMS high-strain sensor based on the recently developed fabrication technology, the Direct Polymer Patterning On Substrate Technique (DPPOST). DPPOST allows lithographically defined elastomer structures to be directly patterned on a substrate in a similar fashion like the lift-off process of evaporated metals. Silicone elastomers (RTV-11 or RTV-615) are used as the matrix materials for the sensor element due to its mechanical properties and widespread availability. Carbon black nano-particles are used to provide the sensing element electrical resistivity on the order 10 Ω-cm. This paper will discuss the design, fabrication, and development of the 1st generation MEMS high strain sensor; for experimental measurements on a highly elastic wing in a low-speed wind-tunnel.

Copyright © 2007 by ASME

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