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New Electrical Potential Method for Measuring Crack Growth in Nonconductive Materials

[+] Author Affiliations
H. Nayeb-Hashemi, D. Swet, A. Vaziri

Northeastern University, Boston, MA

Paper No. IMECE2003-43477, pp. 95-100; 6 pages
doi:10.1115/IMECE2003-43477
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Recent Advances in Mechanics of Solids and Structures
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 0-7918-3726-2 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

D.C. electric potential technique has been used to monitor crack growth in conductive materials. A constant DC current is ppased through thesse materials and the crack length is measured through the changes in the electrical voltage at the crack mouth. However, this method is not applicable in crack growth measurement in nonconductive materials or adhesively bonded joints. For these materials, a new method is developed and is shown to provide a very accurate method for measuring the crack length. The surface of these materials is coated with a thin layer of carbon paint and the crack lenght is measured through the changes in the electrical resistance of the carbon paint, as the crack grows both in the base material and the thin layer carbon paint. In contrast to the D.C. electric potential technique where the position of the probes for measuring the crack length is very important for an accurate measurement of the crack length, the new technique is little sensitive to the probe location. Crack growth is measured in adhesively bonded joints subjected to creep loadings. A modified Compact tension specimen is cut in two pieces across its notch area. The pieces are then glued jusing an adhensive. The surface of the specimen is painted with a thin layer of carbon paint and the changes in its electrical resistance are monitored. It is shown that the carbon paint method provides a quiet sensitive method for monitoring the crack growth. The creep crack growth rate in the adhesively bonded joint is related to Mode I energy release rate, G1 . It is shown that the crack grows in the middle of the adhesive layer rather than at the interface of the joint. Micromechanisms of the crack growth are studied using a scanning electron microscope. The damage consists of numerous crazed regions at the crack tip. Crack grows by the linkage of the crazed region.

Copyright © 2003 by ASME

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