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Template Based Assembly for Solid State Cooling

[+] Author Affiliations
Kerwin Wang, Rajashree Baskaran

Intel Corporation, Chandler, AZ

Karl F. Böhringer

University of Washington, Seattle, WA

Paper No. IPACK2007-33474, pp. 435-437; 3 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400–800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.

Copyright © 2007 by ASME



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