0

Full Content is available to subscribers

Subscribe/Learn More  >

Template Based Assembly for Solid State Cooling

[+] Author Affiliations
Kerwin Wang, Rajashree Baskaran

Intel Corporation, Chandler, AZ

Karl F. Böhringer

University of Washington, Seattle, WA

Paper No. IPACK2007-33474, pp. 435-437; 3 pages
doi:10.1115/IPACK2007-33474
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400–800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.

Copyright © 2007 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In