Full Content is available to subscribers

Subscribe/Learn More  >

Development of New Power MOSFETs Package With Double-Sided Cooling

[+] Author Affiliations
Kisho Ashida, Kenya Kawano, Naotaka Tanaka, Nae Yoneda

Hitachi Ltd., Japan

Akira Muto, Ichio Shimizu

Renesas Technology Corp.

Paper No. IPACK2007-33023, pp. 423-427; 5 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


We developed a new packaging technology, one that uses double-sided cooling to dramatically reduce the on-resistance and thermal resistance. The main features of this technology are as follows. Both sides of the chip are soldered to copper leadframes. After that, copper leadframes soldered to the top and bottom of the chip are exposed when transfer molding encapsulates the package. There were two development problems with packaging technology. The first is how to prevent chip crack in the reflow process. The second is how to improve the fatigue life of solder during the temperature cycling. To solve these problems, we designed our package structure using an experimental design method. In particular, for the second problem, we quantitatively calculated the amount of solder fatigue fracture and the number of cycles using the solder crack propagation analysis method, because the performance of the package depends on the amount of solder fatigue fracture. As a result, we could create a condition that prevented chip crack and improved the fatigue life of solder by the twice compared to the first prototype and determined the optimum structure. We assembled a new package based on this optimum structure, and confirmed this improvement of the reliability. In addition, we measured the on-resistance and thermal resistance of this package and that of the existing package available. We found that the new package’s on-resistance and thermal resistance decreased to about 70 and 80% that of the existing package respectively.

Copyright © 2007 by ASME
Topics: Cooling



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In