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Study of Heat Transfer in Microscale Systems

[+] Author Affiliations
Ryszard J. Pryputniewicz

Worcester Polytechnic Institute, Worcester, MA

Dariusz R. Pryputniewicz

Draper Laboratory, Cambridge, MA

Paper No. IPACK2007-33269, pp. 155-162; 8 pages
doi:10.1115/IPACK2007-33269
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

Progress in micromachining technology enabled fabrication of micron-sized mechanical devices, which have had a major impact on many disciplines. These devices have not only led to development of miniature transducers for sensing and actuation, but also a chip-based chemical laboratory (μChemLab) and other microelectromechanical systems (MEMS). Applications of these microscale systems frequently demand heat removal and temperature control. This paper presents preliminary results of a study of heat transfer in microscale systems. Computational modeling is based on Thermal Analysis System (TAS), which facilitates multiscale modeling/simulation, and measurements are made using infrared (IR) microscopy. Representative applications describe multiscale modeling and measurement results obtained for a microhotplate of a μChemLab and a high-power GaAs FET amplifier. Comparison of the preliminary experimental/measurement and computational/modeling results shows good correlation.

Copyright © 2007 by ASME

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