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Assembly Cost Reduction With Wafer Level Die Attach Film

[+] Author Affiliations
Stewart Dunlap

Intel Corporation, Folsom, CA

Paper No. IPACK2007-33121, pp. 7-9; 3 pages
doi:10.1115/IPACK2007-33121
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

Die attach adhesive is used to connect silicon die together in a chip package. Traditionally, liquid or film adhesive was applied on the surface of the die that was to be attached, and the die was placed on the adhesive. Today the number of dies stacked are increasing, and the thickness of the dies are decreasing. Adhesive lamination quality, adhesive to die edge accuracy, and reduced assembly process steps are all necessary moving forward. An innovative method of applying film on the wafer before the dies are separated, accomplishes these goals. A poster will be used to compare unit versus wafer level die attach film. The poster will clearly show the reduction of the process steps, reduction of the equipment, and the improvement in quality resulting from wafer level die attach film.

Copyright © 2007 by ASME

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