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Design of Packaged RF MEMS Switching Functions on Alumina Substrate

[+] Author Affiliations
Mohamad H. El-Khatib, Arnaud Pothier, Pierre Blondy

XLIM Research Institute, Limoges, France

Paper No. CANEUS2006-11055, pp. 297-300; 4 pages
  • CANEUS 2006: MNT for Aerospace Applications
  • CANEUS2006: MNT for Aerospace Applications
  • Toulouse, France, August 27–September 1, 2006
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4254-1 | eISBN: 0-7918-3787-4
  • Copyright © 2006 by ASME


Microwave coaxial switches used in satellites for instance are quite heavy and bulky and thus have an important after-effect on a payload cost. MEMS devices seems to bring a new alternative for compact switching matrix design which requires a large number of switching devices often incompatible with the semiconductor technology in term of dissipated power [3]. Meanwhile, the reliability of MEMS components for space applications still remains today a problem to be solved, in term of design, technology and cost of realization. Hence the component packaging appears today to be a crucial issue for these devices formed starting from mechanically deformable elements which require a stable environment, clean and deprived of moisture to function in an optimal way [1][2]. In spite of the strong integration of these components, standard packaging solutions are not appropriated for MEMS components [4]. This is why dedicated technological solutions must be developed to encapsulate the component or a group of components on the substrate by using simple techniques limited in term of technological steps.

Copyright © 2006 by ASME



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