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Thermal Boundary Resistance of Thin Metal Films and Thermally Conductive Dielectric Materials

[+] Author Affiliations
Robert J. Stevens, Arthur W. Lichtenberger, Pamela M. Norris

University of Virginia, Charlottesville, VA

Andrew N. Smith

United States Naval Academy, Annapolis, MD

Paper No. IMECE2003-41856, pp. 239-245; 7 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 4
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3718-1 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


Measurement of the thermal boundary resistance by use of a non-destructive optical technique, transient thermoreflectance (TTR), is presented. A simple thermal model for the TTR is presented with a discussion of its applicability and sensitivity. A specially prepared sample series of Cr, Al, Au, and Pt on four different substrates (Si, sapphire, GaN, and AlN) were tested at room temperature and the TTR signal fitted to the thermal model. The resulting thermal boundary conductance values varied by more than a factor of three (0.71 × 108 – 2.3 × 108 W/m2 K). It was shown that the thermal boundary conductance tends to increase as the ratio of the Debye temperatures of the metal film to dielectric substrate approaches unity.

Copyright © 2003 by ASME



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