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Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis

[+] Author Affiliations
M. Hernández-Mora, J. E. González, M. Vélez-Reyes, J. M. Ortíz

University of Puerto Rico at Mayagüez, Mayagüez, Puerto Rico

Y. Pang, E. Scott

Virginia Polytechnic Institute and State University, Blacksburg, VA

Paper No. IMECE2003-42446, pp. 291-298; 8 pages
doi:10.1115/IMECE2003-42446
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 2
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3718-1 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of Integrated Power Electronics Modules (IPEM). This model is based on the expanded Lumped Thermal Capacitance Method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced to only time. Applying this procedure a simple, non-spatial, but highly non-linear model is obtained. Steady and transient results of the model are validated against results from a thermal analysis software tool, FLOTHERM 3.1™. A comparison between thermal results obtained with the reduced model and experimental data is presented indicating a need for incorporating the dynamic electrical performance in the reduced model. The development of this model presents an alternative to reduce the complexity level developed in commercial multidimensional and transient software for power electronics applications.

Copyright © 2003 by ASME

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