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Boiling Performance of Single-Layered Enhanced Structures

[+] Author Affiliations
Camil-Daniel Ghiu, Yogendra K. Joshi

Georgia Institute of Technology, Atlanta, GA

Paper No. IMECE2003-41764, pp. 175-181; 7 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 2
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3718-1 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


A study of pool boiling at atmospheric pressure from single-layered enhanced structures was conducted for a dielectric fluorocarbon liquid (PF 5060). The enhanced structures were fabricated in copper with an overall size of 10 mm × 10 mm and 1 mm thickness. Parallel microchannels were cut on the bottom surface. The top surface also had parallel microchannels, aligned 90 degrees to those on the bottom surface. This resulted in an array of pores at the intersection of the microchannels. The structures were included in a natural circulation flow loop, consisting of an evaporator section, connecting tubes and a condenser. The transparent evaporator chamber contained the boiling enhancement structure. A cartridge heater embedded into a square copper rod (9 mm × 9 mm in cross section) provides heat to the enhanced structure from the bottom. The parameters investigated in this study were: a) heat flux (0.5–35 W/cm2 ); b) confinement (the open top and closed top cases have been studied); c) width of the microchannels (65μm–105μm). The boiling performance of the enhanced structures was evaluated by comparison with that of a flat surface with the same overall dimensions.

Copyright © 2003 by ASME
Topics: Boiling



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