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Thermal Characterization and Optimization of Active System IPEM

[+] Author Affiliations
Ying-Feng Pang, Elaine P. Scott

Virginia Polytechnic Institute and State University, Blacksburg, VA

Paper No. IMECE2003-41415, pp. 161-166; 6 pages
doi:10.1115/IMECE2003-41415
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 2
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3718-1 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

An in depth parametric study was conducted to optimize the thermal performance of an active system integrated power electronic module (IPEM). Commercial finite element software was utilized in these analyses. Design parameters included material selection, geometry, and placement. Model-based optimization software tool were investigated for use in this procedure and demonstrated promise in automating the design process.

Copyright © 2003 by ASME

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