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Variation of Macroscopic Shape and Microstructure of Silver Nanoparticle Suspension Droplets Using Ink-Jet Printing

[+] Author Affiliations
Ming Hsiu Tsai, Weng-Sing Hwang

National Cheng Kung University, Tainan, Taiwan

Hao-Long Chen

Kao Yuan University, Kaohsiung, Taiwan

Paper No. MNC2007-21441, pp. 1471-1475; 5 pages
doi:10.1115/MNC2007-21441
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

Micro-interconnects of integrated circuit (IC) devices were produced using ink-jet printing of Ag nanoparticle suspensions. The macroscopic shape and microstructure of the Ag micro-dot deposits using ink-jet printing were observed using SEM (Scanning Electron Microscope) and EDS (Energy-Disperse Spectrometers). The well-dispersed suspension of nanoparticle Ag colloids, which was made up of 5–10 nm silver particulates, allows low-temperature sintering of Ag. The 50 wt% Ag suspension had a viscosity of about 7.95 cP at 25°C, which is appropriate for printing jobs. A bipolar voltage signal was used to drive a piezo-electric droplet generator and then 50–70 μm diameter droplets was dispensed on the substrate. Using SEM, a smooth deposition of drying silver dot morphology was observed. Drying the silver dots was improved by using hydrophobic substrates and a slow evaporation rate of suspensions was used to resolve an unexpected ring-shape, because both are able to control the interactions among the self-assembled Ag particles, surface tension, and the evaporation rate of droplets. Finally, the deposit/substrate composite was processed at 300°C for 60 min under a pure oxygen atmosphere to allow for the complete evaporation of the carrier and for sintering of the nano-particles, thereby yielding a finished circuit interconnect.

Copyright © 2007 by ASME

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