0

Full Content is available to subscribers

Subscribe/Learn More  >

Slurry Flow in CMP Considering the Pad Roughness and Porosity

[+] Author Affiliations
Chaohui Zhang, Wei Ye

Beijing Jiaotong University, Beijing, China

Paper No. MNC2007-21200, pp. 1319-1323; 5 pages
doi:10.1115/MNC2007-21200
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

Chemical mechanical polishing (CMP) is a widely adopted technique to achieve high level of global and local planarity required in modern integrate circuit (IC) industries and hard disk manufacturing process, etc., wherein the slurry flow weighs heavily on the performance. The pad surface will alter the flow features considerably. A preliminary wafer-scale flow model for CMP is presented considering the roughness as well as the porosity of the pad. Numerical simulations were conducted to show the slurry flow features. The results show that the porosity of the pad is conducive to slurry delivering, and small porous parameter will lead to prominent increase of load capability, accounting for larger material removal rate. The rough surface carries additional fluid in the valleys of the polishing pad thereby provide some chemical reactions. The model predictions will be conducive to the removal rate and mass transport computation. This will shed lights on the mechanism of CMP process, which is for a long time considered as a difficult circle to square.

Copyright © 2007 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In