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Transmission Microscopic Moiré Interferometry for Nanoscale Deformation Measurements

[+] Author Affiliations
C. W. Han, S. Cho, B. Han

University of Maryland, College Park, MD

Paper No. IMECE2003-42221, pp. 869-870; 2 pages
doi:10.1115/IMECE2003-42221
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Moiré interferometry is a full-field optical method that has high displacement, strain and spatial resolution. The method has been used extensively for deformation analyses in the various fields of mechanics. Special considerations arise when deformation measurements of tiny specimens or tiny regions of larger specimens are sought. The relative displacements within a small field of view will be small (even if the strains are not small), so the number of morié fringes might not be enough for an accurate analysis.

Copyright © 2003 by ASME

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