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Thermal Property Measurement of Thin Aluminum Oxide Layers for Giant Magnetoresistive (GMR) Head Applications

[+] Author Affiliations
Bahareh Behkam, Yizhang Yang, Mehdi Asheghi

Carnegie Mellon University, Pittsburgh, PA

Paper No. IMECE2003-41626, pp. 855-860; 6 pages
doi:10.1115/IMECE2003-41626
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

In recent years, the magnetic recording storage industry has developed a growing interest in increasing recording density of the magnetic disks. Since dimensions of the recording head read transducer have been scaled down to increase areal density, all other parameters being equal, the energy required to cause damage by an ElectroStatic Discharge (ESD) event is reduced substantially. The reduction of insulator thickness between the leads and shields, to increase linear density, further lowers the threshold for ESD breakdown voltage. This problem will become increasingly acute with use of a large number of new and exotic passivation materials having low dielectric constants and thermal conductivities. The present work characterizes the thermal transport properties of Al2 O3 Gap layer, which are essential to address the ESD failure in GMR head. This study provides data for out-of-plane (normal) thermal conductivity of thin Al2 O3 layers. Thermal conductivity data is obtained using steady-state Joule heating and electrical-resistance thermometry technique.

Copyright © 2003 by ASME

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