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Electroplated Si3N4 Reinforced Metal Matrix Nanocomposites

[+] Author Affiliations
Xiaochun Li, Zhiwei Li

University of Wisconsin at Madison, Madison, WI

Paper No. IMECE2003-41104, pp. 809-813; 5 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


Permalloy NiFe matrix nanocomposite layers were electroplated on a copper substrate. The volume fraction of nano-sized Si3 N4 particles in NiFe matrix was controlled by the addition of various percentages of Si3 N4 particles in the NiFe electrolyte. The nanocomposite layers were analyzed by a scanning electron microscopy (SEM). Microhardness test was performed. With nano-sized Si3 N4 particles in the NiFe matrix, the microhardness of NiFe was improved. The samples were then annealed at 800 °C for about 20 hours. The microhardness declined more with more Si3 N4 particles in the NiFe matrix. The analysis result from Energy Dispersive Spectrometer (EDS) in the SEM showed that the hardness declination could be caused by the segregation of Si3 N4 in the NiFe matrix. Finally this paper presents nanocomposite micromolds fabricated by electroplating onto polymer molds that were fabricated by micro-stereolithgraphy.

Copyright © 2003 by ASME



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