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A Microchannel Heat Sink With Unitary Circular Flow and Short Distance Heat Transfer Mode: Design and Analysis

[+] Author Affiliations
Y. Wang, G. F. Ding

Shanghai Jiaotong University, Shanghai, China

Paper No. MNC2007-21075, pp. 747-750; 4 pages
doi:10.1115/MNC2007-21075
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

The simulation of the forced convection heat transfer occurring in a microchannel heat sink with unitary circular flow and short distance heat transfer is presented. The temperature and velocity distributions of the coolant in the microchannels under the different flow rates were performed using the commercial FE software package [ANSYS]. The lowest flow rate satisfying the maximum operating temperature of the electronic device is 2ml/min with the input heat flux 25W/cm2 . The temperature difference along flow direction in the lognitudinal channel with the transverse channel arrays is reduced compared with the traditional parallel channel structure. A uniform temperature distribution and high heat transfer efficiency are developed.

Copyright © 2007 by ASME

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