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The Uniaxial Tension Properties of Silver Nanorod by Molecular Dynamics Simulations

[+] Author Affiliations
Li Chen, Heng Liu, Lie Yu

Xi’an Jiaotong University, Xi’an, China

Paper No. MNC2007-21479, pp. 699-704; 6 pages
doi:10.1115/MNC2007-21479
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

Using Sutton-Chen many-body potential, the mechanical characteristics of silver nanorod subjected to 001 uniaxial tensile strain are simulated with molecular dynamics. The results indicate that the tensile deformation process consists of an elastic and a plastic periods. The atomic configurations change little in elastic period but change obviously in plastic period. The changes of atomic configurations directly determine the corresponding stress-strain relation. The stress increases linearly as strain grows within the process of elastic deformation. The stress fluctuates greatly in plastic period. With detailed analysis, the dislocations and slips of atoms lead to the stress oscillation. The influences of size effects on tension properties are investigated simultaneously. Young’s modulus heightens and the elastic ultimate stress decreases with the increasing global size of nanorod. Both of them approach to that of macroscopic material as the global size increases. At the same time, the tension properties of Silver nanorod with vacancy defects are investigated. When the vacancy density is less than 0.1%, the Young’s modulus of defect crystals are almost same as that of free-defect crystals, but the elastic ultimate stress is less than that of free-defect crystals. The Young’s modulus and elastic ultimate stress and strain are all decrease with the increment of vacancy density.

Copyright © 2007 by ASME

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