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Comparative Study of Spray and Multiple Micro Jets Cooling for High Power Density Electronic Applications

[+] Author Affiliations
Matteo Fabbri, Shanjuan Jiang, Vijay K. Dhir

University of California at Los Angeles, Los Angeles, CA

Paper No. IMECE2003-42325, pp. 657-665; 9 pages
doi:10.1115/IMECE2003-42325
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Direct cooling by means of jets and sprays has been considered a solution to the problem of cooling high power density electronic devices. Although both methods are capable of very high heat removal rates it is necessary to be able to decide which one is more convenient than the other when designing a cooling system for electronic applications. In this work the results of an investigation of the performances of sprays and arrays micro jets are reported. Experiments have been conducted using HAGO nozzles and orifice plates to create droplet sprays and arrays of micro jets, respectively. The liquid jets had diameters ranging from 50 to 150 μm and the pitches between the jets were 1, 2, and 3 mm. The test fluid was deionized water and the jet Reynolds number ranged between 90 and 2600. A comparison of the results obtained employing both sprays and jets has been carried out. The micro jets have dimensions of the same magnitude or smaller than those of the electronic components. The micro jet arrays give better heat transfer rates than the large diameter ones studied in the past and they use liquid mass flow rates similar to those used by the sprays.

Copyright © 2003 by ASME
Topics: Density , Cooling , Jets , Sprays

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