0

Full Content is available to subscribers

Subscribe/Learn More  >

Characterization of Surface Layer of Silicon Wafer by Using Nano Indenter

[+] Author Affiliations
Yu-Li Sun, Dun-Wen Zuo, Yong-Wei Zhu, Feng Xu, Min Wang

Nanjing University of Aeronautics and Astronautics, Nanjing, China

Paper No. MNC2007-21233, pp. 649-653; 5 pages
doi:10.1115/MNC2007-21233
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

Mechanical properties of the silicon wafer are evaluated by a nano indenter system with the continuous stiffness measurement (CSM) technique. Contact stiffness, hardness and elastic modulus of the silicon wafer are continuously measured during the loading in an indentation test. The results show that when the contact depth is between 20 and 32 nm, its contact stiffness is linear with the contact depth, and its hardness and elastic modulus keep constant at 10.2 GPa and 140.3 GPa respectively, which belong to the oxide coating of the silicon wafer. When the contact depth is between 32 and 60 nm, its contact stiffness is not linear with the contact depth, and the hardness and elastic modulus increase rapidly with the contact depth, because they are affected by the bulk material. When the contact depth is over 60 nm, the contact stiffness of the silicon wafer is linear with the contact depth again, and the hardness and elastic modulus keep constant at 12.5 GPa and 165.6 GPa respectively, which belong to the silicon wafer, the bulk material.

Copyright © 2007 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In