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Application of Cryogenics to Electronics

[+] Author Affiliations
Joseph L. Smith, Jr.

Massachusetts Institute of Technology, Cambridge, MA

Paper No. IMECE2003-42193, pp. 615-618; 4 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


One of the impediments to the application of cryogenics to electronic apparatus is the incompatibility of equipment developed for operation in an ambient environment with a cryogenic environment. The need for the development of cooling and packaging concepts optimized for operation at cryogenic temperature is discussed The opportunities for high efficiency cryocoolers for temperatures of 10 K and below are presented. An entropy flow view of refrigerated cooling is presented. The available methods of refrigeration for operating electronic components at cryogenic temperature are outlined briefly. The three-stage modular Collins-cycle cryocooler that is being developed at the MIT and AMTI is described.

Copyright © 2003 by ASME



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