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Joining Mechanism of Static Bonding Between β"-Al2O3 and L2-Aluminum

[+] Author Affiliations
Cuirong Liu

Taiyuan University of Technology; Taiyuan University of Science and Technology, Taiyuan, China

Qingsen Meng, Lifang Hu

Taiyuan University of Technology, Taiyuan, China

Paper No. MNC2007-21576, pp. 601-605; 5 pages
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME


Electrostatic bonding, as a special method of solid-state diffusion bonding for the ceramics and the metals, can be performed at low temperature quickly and conveniently. And It’s suitable for making micro electromechanical system (MEMS), such as micro-devices, solar cell and micro-sensors. So Electrostatic bonding process mainly is used to bond the fast-ion conductivity materials and the metals. The bonding technique of functionally materials and metals had a significant role in the manufacture of MEMS. In this paper, the L2 aluminum film and β"-Al2 O3 sheet were bonded by the electrostatic bonding process. SEM, EDX, XRD were applied to investigate the interfacial structure and composition of the samples, and the bonding mechanism and technical condition were characterized precisely. The experimental results showed that the electrolyte ceramics and aluminum can be bonded very well. The bonding area was composed of Al metal, transition area and aluminum oxide. The successful bonding was achieved due to the formation of the oxide in the interface. The main factors that influenced the bonding process were voltage, temperature and the electrical conductivity of the materials.

Copyright © 2007 by ASME



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