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Challenges in Energy Efficient Thermal Management

[+] Author Affiliations
Kazuaki Yazawa

Sony Corporation, Chiba, Japan

Paper No. IMECE2003-42177, pp. 577-582; 6 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


For a surveillance of energy efficient thermal management, an extended review of literatures has been done. Covered cooling technologies are intended for or supposed to relate to energy efficient design. Individual technologies are categorized with the discussion of advantage/disadvantages. In addition, the impact such as volume and mass of total system design is discussed. A universal criterion of metric to measure the effectiveness of optimization for minimum energy input is proposed. Extensive review of the supposed relevant technologies gives the idea that each model could be used for energy efficient thermal design. On the other hand, it has been found that the lack of system level modeling as well as the considerations of transient phenomena is not enough. Since these are essential, it should be the challenge toward the future of environmental friendly thermal designs.

Copyright © 2003 by ASME



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