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[+] Author Affiliations
Robert J. Moffat

Stanford University, Stanford, CA

Paper No. IMECE2003-42176, pp. 565-575; 11 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


In all electronics cooling situations, and many other practical situations, the surface temperature varies in the stream-wise direction. In these cases, defining the heat transfer coefficient using the adiabatic temperature of the surface instead of the mixed mean temperature of the coolant result in significant benefits. The resulting definition is hadiabatic . The theoretical and practical bases for hadiabatic are presented. Examples of its use in electronics cooling are described to show the operational advantages this approach offers. Turbulence strongly affects heat transfer. A simple, turbulence-based correlation is presented that yields an estimate of the heat transfer coefficient good enough for preliminary design estimates and often as accurate as can be relied upon from CFD calculations using present codes.

Copyright © 2003 by ASME



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