0

Full Content is available to subscribers

Subscribe/Learn More  >

Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation

[+] Author Affiliations
Donghyun Kim, Glenn Y. Masada, Tess J. Moon

University of Texas at Austin, Austin, TX

Andrew Mawer

Motorola, Inc., Austin, TX

Paper No. IMECE2003-43236, pp. 505-514; 10 pages
doi:10.1115/IMECE2003-43236
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Solder joints in electronic packages deform by creep and undergo a microstructural evolution process that includes grain coarsening, voiding, microcracking, and macrocracking. This paper describes an FEM model of the crack initiation process of SnPb and SnAgCu solder joints in 357 plastic ball grid array packages for different aging conditions and simulated under 0–100°C accelerated thermal cycling tests. The simulations show that 1) cracks initiate at the package interface first, and then at the opposite side of the board interface; 2) secondary cracks initiate at the opposite end of the primary crack at the joint interfaces; 3) no secondary cracks occur at the package interface of ages SnPb joints, since compressive stresses oppose void formation; and 4) it takes longer to initiate cracks in SnAgCu joints than SnPb joints. The damage process in the solder joints was simulated from grain coarsening, voiding, to microcracking, with SnAgCu joints not undergoing grain coarsening due to their stable microstructure. The model results were consistent with experimental results in the number and location of cracks in the joints.

Copyright © 2003 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In