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Study of Alternate Surface Finishes for Quad Flat Packs

[+] Author Affiliations
Muffadal Mukadam, K. Srihari

State University of New York at Binghamton, Binghamton, NY

Michael Meilunas

Universal Instruments Corporation, Binghamton, NY

Paper No. IMECE2003-42846, pp. 495-503; 9 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


The purpose of this study is to evaluate three different QFP lead finishes using steam age preconditioning. This evaluation is based on solder joint strength measured by lead pull test. The effects of steam age preconditioning on solder voiding, wetting, fillet formation, and solder joint strength is included. This paper also summarizes the details of the QFP assembly build and process characterization using visual inspection, X-ray, and cross-sectional analysis. Furthermore, microscopic examination of the fracture surfaces following the lead pull tests was performed.

Copyright © 2003 by ASME
Topics: Finishes



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