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An Experimental Study of TMAH Etching Silicon for MEMS

[+] Author Affiliations
Feiyan Chen

Guangdong University of Technology, Guangzhou, China; Jimei University, Xiamen, China

Guoqing Hu

Guangdong University of Technology, Guangzhou, China; Xiamen University, Xiamen, China

Baihai Wu

Guangdong University of Technology, Guangzhou, China

Paper No. MNC2007-21292, pp. 491-494; 4 pages
doi:10.1115/MNC2007-21292
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

In the process of Micro-Electrical-Mechanical System (MEMS), the anisotropic wet chemical etching rate of the silicon wafer is very important for fabricating MEMS to determine the fabricating method, processing and etching time. The etching rates of the silicon wafer in the TMAH solution with the different temperature are obtained in this paper. The micro-fabrication technology and micro-fabrication process are also discussed. In the same time, all experimental data are put forward in details.

Copyright © 2007 by ASME

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