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Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment

[+] Author Affiliations
Zhong-Shan Deng, Jing Liu, Yi-Xin Zhou

Chinese Academy of Sciences, Beijing, China

Paper No. MNC2007-21266, pp. 463-464; 2 pages
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME


The thermal management of the increasing fast chips has been a major concern in packaging of micro/nano systems [1]. These chips are squeezing into tighter and tighter spaces with no enough places for heat to dissipate. It is expected that heat flux levels in excess of 100 W/cm2 for commercial electronics and over 1000 W/cm2 for selected military high power electronics will soon become a realistic challenge to overcome. Meanwhile, high-capacity cooling options remain limited for many small-scale applications such as micro-systems, sensors and actuators, and micro/nano electronic components.

Copyright © 2007 by ASME



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