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The Effects of Processing Conditions on the Thermal Conductivity of Polycrystalline Silicon Films

[+] Author Affiliations
Samuel Graham, Brandon Olson, Channy Wong, Edward Piekos

Sandia National Laboratories, Livermore, CA

Paper No. IMECE2003-42091, pp. 455-459; 5 pages
doi:10.1115/IMECE2003-42091
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Polycrystalline silicon has been a primary material used in development of mocroelectrical mechanical systems due to its attractive structural properties and compatibility with CMOS processing. Among its many applications, polysilicon is currently being employed in MEMS devices that require thermal dissipation or thermal management to ensure functionality (thermal actuators, microengines, etc.). In these applications, heat conduction in polycrystalline silicon becomes a primary factor in the design, performance, and reliability of thermal MEMS.

Copyright © 2003 by ASME

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