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Transient Thermal Evaluation for Integrated Motor Control System With Multiple Dynamic Heat Sources

[+] Author Affiliations
Victor Adrian Chiriac, Tien-Yu Lee, David Bien

Motorola, Inc., Tempe, AZ

Paper No. IMECE2003-42050, pp. 447-453; 7 pages
doi:10.1115/IMECE2003-42050
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

A detailed transient thermal analysis for a single-chip silicon Integrated Motor Control System with multiple dynamic heat sources with various applications in electronics packaging is performed using numerical simulations. The challenge resides in the transient thermal interaction between the various dynamic heat sources, activated simultaneously at different powering profiles. Several operating steps are simulated, and the transient thermal behavior for each source is identified during the process. The peak temperature reached by one of the main motors (powered for 3.6W@15ms) is 68.1°C, ∼14°C lower than its peak temperature with all the other heat sources on, indicating the thermal impact of the surrounding heat sources on the main motor within the first 15 ms. The temperature limits are not exceeded by the system during operation. When the die is powered with uniform 1.6W under steady state conditions, the peak temperature reaches ∼74.8°C (associated junction-to-ambient Rja thermal resistance is ∼31.2°C/W. The replacement of the custom-made board with a standard JEDEC board leads to a drop in the overall junction-to-ambient thermal resistance by almost 20%. An analytical validation for an equivalent simplified transient model is performed. The short-time thermal transient study and the specific set of boundary conditions are a close approximation to the closed form solution of the one-dimensional semi-infinite solid exposed to a uniform heat flux at its free surface. The analytical results are in good agreement with the simulation.

Copyright © 2003 by ASME
Topics: Heat , Motor controls

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