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Lead-Free Solder-Joint Reliability of a Photonic Device Under Transient and Steady State Loadings

[+] Author Affiliations
Walter Dauksher

Agilent Technologies, Inc., Fort Collins, CO

John Lau

Agilent Technologies, Inc., Santa Clara, CA

Paper No. IMECE2003-42253, pp. 387-394; 8 pages
doi:10.1115/IMECE2003-42253
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Three solders, 63wt%Sn-37wt%Pb, 80wt%Au-20wt%Sn and 95.5wt%Sn-3.9wt%Ag-0.6wt%Cu, are studied as interconnect materials in a vertical-cavity surface-emitting laser, or VCSEL. While the Au-Sn alloy is a lead-free solder material that had been previously identified as a candidate material for this device, the Sn-Ag-Cu solder (henceforth SAC solder) is presently the leading lead-free solder candidate for numerous packaging types. In the present study, thermal-structural analysis evaluates the solder alloys in the context of in-service operating conditions. Specifically, the thermal analysis determines the in-service temperature distributions, as influenced by each solder alloy, due to power generation within the VCSEL and due to convective boundary conditions. Subsequently, these thermal profiles are used as the thermal loads in an evaluation of the creep response in the solder materials. Emphasis is placed on the relaxation of stresses and on the creep strains developed during a 24 hour power-on condition.

Copyright © 2003 by ASME

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