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Study on the Uniformity of Micro Electroforming Mold Insert Used in Micro Fluidic-Chip Fabrication

[+] Author Affiliations
Liqun Du

Dalian University of Technology, Dalian, China

Haijun Liu, Chong Liu, Shenmiao Zhu, Jiang Qin

Dalian University of Technology, Dalian, Liao Ning, China

Paper No. MNC2007-21100, pp. 329-334; 6 pages
doi:10.1115/MNC2007-21100
From:
  • 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
  • First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B
  • Sanya, Hainan, China, January 10–13, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4265-7 | eISBN: 0-7918-3794-7
  • Copyright © 2007 by ASME

abstract

In the paper, a theoretical investigation was presented, which is used to explain the effect of pulse-reverse current on uniformity in micro-electroforming. And micro-electroforming experiments of two different pulse-reverse currents with gaps in positive direction were carried out correspondingly. The mold inserts used in micro fluidic-chip were micro-electroformed in these experiments, and its feature width is 90um. No backing process was adopted, which mainly consisted of three procedures. Two different pulse-reverse currents used in these experiments were pulse-reverse current with gaps in both positive and negative direction, and pulse-reverse current with gaps only in positive direction, respectively. The fundamental parameters of these experiments were summarized from lots of micro-electroforming experiments of pulse current. After experiments, comparisons were carried out between the results of pulse-reverse current experiments and pulse current experiment. Because negative current could erode the tips on electroforming surface, better uniformity was obtained in these experiments using pulse-reverse currents. The experimental results were consistent with the theoretical investigation.

Copyright © 2007 by ASME

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