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Effect of Hygroscopic Swelling of Mold Compound on PEM Reliability

[+] Author Affiliations
B. Han, E. Stellrecht, M. Pecht

University of Maryland, College Park, MD

Paper No. IMECE2003-42223, pp. 371-372; 2 pages
doi:10.1115/IMECE2003-42223
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Polymeric mold compounds absorb moisture, and thus swell, when exposed to a humid environment [1]. Hygroscopic stresses arise in plastic encapsulated microcircuits (PEMs) when the mold compound swells upon absorbing moisture and the lead frame, die paddle, and semiconductor chip, do not experience swelling.

Copyright © 2003 by ASME

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