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A Closed Loop Impinging Jet Cooling for Computer Chip

[+] Author Affiliations
Jemmy Sutanto Bintoro

Georgia Institute of Technology, Atlanta, GA

Aliakbar Akbarzadeh

RMIT University, Bundoora, Victoria, Australia

Masataka Mochizuki, Thang Nguyen

Fujikura, Ltd., Tokyo, Japan

Paper No. IMECE2003-43865, pp. 349-355; 7 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


This paper present a new cooling system that adopted triple technologies: Rankine cycle, impingement jet, and mini channel heat exchanger. However the report of his paper will be concentrated in the impinging jet cooling. The established cooling system had capability of removing the maximum heat of 200 W from a single chip with D = 12 mm, which is equivalent to the heat flux of 177 W/cm2 . The System maintained the maximum chip-surface temperature of less than 95 °C and the chip temperature variation of less than 2.5 °C. At ambient temperature of 30 °C, the surface temperature of heat exchanger is less than 65 °C.

Copyright © 2003 by ASME



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