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Thermomechatronics of Power Electronics

[+] Author Affiliations
R. E. Watts, K. Fedje, M. C. Shaw

California Lutheran University, Thousand Oaks, CA

E. R. Brown

University of California at Los Angeles, Los Angeles, CA

Paper No. IMECE2003-41805, pp. 241-246; 6 pages
doi:10.1115/IMECE2003-41805
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage.

Copyright © 2003 by ASME
Topics: Electronics

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