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Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)

[+] Author Affiliations
John Lau, Walter Dauksher

Agilent Technologies, Inc., Santa Clara, CA

Paper No. IMECE2003-55041, pp. 229-238; 10 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The CCGA (ceramic column grid array) package developed by IBM is one of the best candidates for housing these kinds of chips [1–7]. There are two parts in this study. One is to show that the 2-parameter Weibull life distribution is adequate for modeling the thermal-fatigue life of lead-free solder joints. This is demonstrated by comparing the 2-parameter and 3-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5wt%Sn3.9wt%Ag0.6wt%Cu lead-free solder paste on lead-free PCBs (printed circuit boards) under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density of the 1657-pin CCGA solder column with two different solder paste materials, namely, 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb and under three different thermal cycling profiles, namely, 25 ↔ 75°C, 0 ↔ 100°C, and −25 ↔ 125°C. The effects of these solder pastes and temperature conditions on the thermal-fatigue life of the high-lead (10wt%Sn90wt%Pb) solder columns of the CCGA package are provided and discussed.

Copyright © 2003 by ASME



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