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Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints

[+] Author Affiliations
N. Islam, J. C. Suhling, P. Lall, T. Shete, H. S. Gale, R. W. Johnson, M. J. Bozack

Auburn University, Auburn, AL

P. Seto, T. Gupta, J. R. Thompson

DaimlerChrysler, Huntsville, AL

Paper No. IMECE2003-42117, pp. 225-228; 4 pages
doi:10.1115/IMECE2003-42117
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

In this study, we have examined the thermal cycling reliability of several lead free chip resistor solder joint configurations. Five sizes of resistors (2512, 1206, 0805, 0603, 0402), 2 temperature ranges (−40 to 125°C and −40 to 150°C), and five different solder types have been examined. The solders include the normal SnAgCu alloy recommended by earlier studies (95.5Sn-3.8Ag-0.7Cu), and several variations that include small percentages of Bismuth and Indium to enhance fatigue resistance. Results have been compared to data for standard 63Sn-37Pb joints.

Copyright © 2003 by ASME

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