Full Content is available to subscribers

Subscribe/Learn More  >

Viscoplastic Constitutive Properties and Reliability of Lead-Free Sn3.9Ag0.6Cu Solder

[+] Author Affiliations
Qian Zhang, Abhijit Dasgupta, Peter Haswell

University of Maryland, College Park, MD

Paper No. IMECE2003-41840, pp. 215-224; 10 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


The viscoplastic constitutive properties of Sn3.9Ag0.6Cu lead-free alloy are presented and compared with baseline data from eutectic Sn63Pb37 solder. Steady-state creep models are obtained from creep and monotonic tests at three different temperatures for both solders. Based on steady-state creep results and creep test data, a transient creep model is developed for both Pb-free and Sb37Pb solders. One-dimensional incremental model of the test setup is developed to simulate constant-load creep, monotonic, and isothermal cyclic mechanical tests performed over various temperatures, strain rates and stresses using a thermo-mechanical-microstructural (TMM) test system, developed by the authors. By fitting simulation results to monotonic testing data, plastic models are also achieved. The devoloped viscoplastic constitutive models are evaluated in a two-dimensional nonlinear Finite element analysis of a PBGA352 package under a −55°C∼125°C thermal cycling environment. The viscoplastic behavior of Pb-free solder is compared with that of eutectic Sn37Pb solder.

Copyright © 2003 by ASME
Topics: Solders , Reliability



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In