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Viscoplastic Constitutive Properties and Reliability of Lead-Free Sn3.9Ag0.6Cu Solder

[+] Author Affiliations
Qian Zhang, Abhijit Dasgupta, Peter Haswell

University of Maryland, College Park, MD

Paper No. IMECE2003-41840, pp. 215-224; 10 pages
doi:10.1115/IMECE2003-41840
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

The viscoplastic constitutive properties of Sn3.9Ag0.6Cu lead-free alloy are presented and compared with baseline data from eutectic Sn63Pb37 solder. Steady-state creep models are obtained from creep and monotonic tests at three different temperatures for both solders. Based on steady-state creep results and creep test data, a transient creep model is developed for both Pb-free and Sb37Pb solders. One-dimensional incremental model of the test setup is developed to simulate constant-load creep, monotonic, and isothermal cyclic mechanical tests performed over various temperatures, strain rates and stresses using a thermo-mechanical-microstructural (TMM) test system, developed by the authors. By fitting simulation results to monotonic testing data, plastic models are also achieved. The devoloped viscoplastic constitutive models are evaluated in a two-dimensional nonlinear Finite element analysis of a PBGA352 package under a −55°C∼125°C thermal cycling environment. The viscoplastic behavior of Pb-free solder is compared with that of eutectic Sn37Pb solder.

Copyright © 2003 by ASME
Topics: Solders , Reliability

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