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Prediction of Rate-Dependent Constitutive Behavior of Pb-Free Solders

[+] Author Affiliations
Qian Zhang, Pradeep Sharma, Abhijit Dasgupta

University of Maryland, College Park, MD

Paper No. IMECE2003-41774, pp. 209-214; 6 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


This paper examines a potential microscale mechanism that contributes to rate-dependent creep of Sn3.9Ag0.6Cu Pb-free solders. The experimentally measured transient and steady-state creep constitutive properties are first presented. Empirical constitutive models are derived, based on this data. Finally, a microstructural model, based on thermally activated dislocation detachment, is explored as a possible source of the creep behavior. This approach explicitly includes microstructural features such as grain size, particle size, particle spacing, etc. The model is calibrated by using the steady-state creep test results to estimate the dislocation density as a function of the stress and temperature. The behavior of the model is explored for different dispersoid sizes as the particle sizes of Cu6 Sn5 and Ag3 Sn intermetallics are known to vary between 5 and 50 nm [Wiese, et. al., 2001]. The results indicate that dislocation detachment can only dominate over a limited range of particle sizes and stress magnitudes at each temperature. Other competing rate-governing mechanisms are Coble creep at low stresses and dislocation climb at high stresses.

Copyright © 2003 by ASME



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