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Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards

[+] Author Affiliations
Saketh Mahalingam, Shashikant Hegde, Gnyaneshwar Ramakrishna, Raghuram V. Pucha, Suresh K. Sitaraman

Georgia Institute of Technology, Atlanta, GA

Paper No. IMECE2003-41645, pp. 165-170; 6 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


This paper studies several base substrate materials and interlayer dielectric materials for High Density Interconnect (HDI) boards, addressing reliability issues such as warpage, dielectric cracking and microvia cracking. Design of simulation models with an optimization technique is developed to study material interaction effects on the HDI reliability. A plastic strain gradient-based computational algorithm is developed to study the thermo-mechanical deformation of fine-feature microvia structures.

Copyright © 2003 by ASME
Topics: Density , Reliability , Lumber



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