Full Content is available to subscribers

Subscribe/Learn More  >

A Packaging Solution for Pressure Sensor MEMS

[+] Author Affiliations
J. Wei, G. J. Qi, Z. F. Wang, Y. F. Jin, P. C. Lim, C. K. Wong

Singapore Institute of Manufacturing Technology, Singapore

Paper No. IMECE2003-42824, pp. 113-118; 6 pages
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME


In this paper, a wafer-level packaging solution for pressure sensor microelectromechanical system (MEMS) is reported. Sensor and glass cap wafers are anodically bonded at a bonding temperature less than 400°C. Bubble free interfaces are obtained and the bond strength is higher than 20 MPa. Sensor and bottom silicon cap wafers are bonded at a temperature of 400–450°C with the assistance of a gold intermediate layer. The bond strenght is higher than 5 MPa. The via holes, used for feedthroughs leading out the circuit, on bottom silicon cap wafer are anisotropically formed in KOH etching solution. Aluminum layer is sputtered on the bottom silicon wafer for electrical connection, re-routing circuit and the seed layer of under bump metallization (UBM). During sputtering process, the sidewalls of via holes are also sputtered with aluminum film. At the same time, the metal pads on sensor wafer are also built up to connect with metallized via holes. It is found that the cavities are vacuum sealed. Sputtered Cr/Ni/Au layers are used for UBM layers. Finally, solder bumps can printed or plated on the UBM. The whole process leads to promising performance of the devices.

Copyright © 2003 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In