0

Full Content is available to subscribers

Subscribe/Learn More  >

Characterization of Anisotropic Conductive Adhesives

[+] Author Affiliations
Abhijit Dasgupta, J. Caers, Preethi Iyer, Pascal Baumgaertner, Daniel Farley

University of Maryland, College Park, MD

Paper No. IMECE2003-42022, pp. 19-26; 8 pages
doi:10.1115/IMECE2003-42022
From:
  • ASME 2003 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
  • Washington, DC, USA, November 15–21, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3714-9 | eISBN: 0-7918-4663-6, 0-7918-4664-4, 0-7918-4665-2
  • Copyright © 2003 by ASME

abstract

Thermomechanical stress analysis of Flip-chip-on-flex (FCOF) has been investigated. The effect of bonding pressure on the reliability is analyzed. Key findings are: shear forces are the dominant forces acting across the interconnect and govern the reliability of the package, FCOFs bonded at higher pressures develop lower shear stress and packages with higher bump heights exhibit better performance. This study encompasses testing of packages under thermal shock treatment and results being verified by a 2D linear elastic model. Parametric studies that might provide useful design guidelines are also included.

Copyright © 2003 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In