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Miniaturized Refrigeration System With Advanced PCM Micro Encapsulation Technology

[+] Author Affiliations
Mohammed Farid, Michael Smith

University of Auckland, Auckland, New Zealand

Rami Sabbah, Said Al Hallaj

Illinois Institute of Technology, Chicago, IL

Paper No. ICNMM2007-30209, pp. 1105-1112; 8 pages
doi:10.1115/ICNMM2007-30209
From:
  • ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels
  • Puebla, Mexico, June 18–20, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4272-X | eISBN: 0-7918-3800-5
  • Copyright © 2007 by ASME

abstract

Technology advances in microchips and miniaturized refrigeration systems require heat to be removed at a high flux. Microchannel heat exchangers have been implemented for the efficient removal of heat in these applications. However, the maximum achievable heat flux is still limited even when two-phase flow (evaporation) is used, due to the formation of vapor film along the wall of the heat exchanger. In this presentation, the principle of using a suspension of microcapsules in liquid as a heat transfer fluid to improve the performance of microchannel heat exchangers will be discussed. The microcapsules contain phase change material, which melts and solidifies at a specified range of temperatures. These microcapsules improve the fluid effective specific heat capacity and thermal conductivity due to latent heat effect and micro mixing respectively.

Copyright © 2007 by ASME

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