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Numerical and Experimental Research on Fluid Flow and Heat Transfer in Miniscale Channels

[+] Author Affiliations
Wenguang Geng

Shandong University, Jinan, China

Baoming Chen

Shandong Jianzhu University, Jinan, China

Paper No. ICNMM2007-30079, pp. 739-748; 10 pages
  • ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels
  • Puebla, Mexico, June 18–20, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4272-X | eISBN: 0-7918-3800-5
  • Copyright © 2007 by ASME


The high rates of heat transfer obtained by using micro or mini channels makes them an attractive alternative to conventional methods of heat dissipation, especially in microelectronics cooling system. In this paper, three dimensional fluid flow and heat transfer phenomena for different coolant in rectangular, elliptic and triangular miniscale channels is investigated. In all computational regions this paper improved the Boussinesq and the thermal physical properties of the coolant are temperature dependent. The heat transfer Nusselt numbers and flow resistance coefficients of different channels are obtained, and the pressure drop and the temperature increasing of the coolant in three mini channels are studied. The numerical simulation shows that the mini rectangular channels’ heat transfer and flow resistance characteristics are optimal.

Copyright © 2007 by ASME



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