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Micro Pattern Filling Simulation to See the Effects of Process Parametric Variables on Imprinting

[+] Author Affiliations
Jinho Mok, Sukwon Lee, JeHyoung Ryu, Hyuk Kim, Sin Kwon, Seong-Gu Baek, Jung-Woo Park, Jungwoo Seo

Samsung Electronics, Suwon, South Korea

Paper No. ICNMM2007-30014, pp. 141-145; 5 pages
  • ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels
  • Puebla, Mexico, June 18–20, 2007
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4272-X | eISBN: 0-7918-3800-5
  • Copyright © 2007 by ASME


The nano imprint lithography, a new approach to lithography, is a very useful alternative for the conventional photolithography process. To apply this new technology to the lithography process, new equipment, process parameters and post processes must be taken into consideration. If the defects during imprinting can be detected by optical measuring only after finishing the whole process, the engineers have no choice but analyze the sample of a final form to analogize the cause of defects. To set up the optimal process conditions, simulation is a very useful method in terms of not only the minimum number of trial and error but also the quantitative data based design. In this study, a few process parameters that affect the micro pattern forming in the nano imprint process are chosen and examined to present the quantitative data useful to set up the process conditions for the residual bubble free process.

Copyright © 2007 by ASME
Topics: Simulation



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