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Nanoscale Heat Conduction Across Metal-Dielectric Interfaces

[+] Author Affiliations
Y. Sungtaek Ju, Ming-Tsung Hung, Takane Usui

University of California at Los Angeles, Los Angeles, CA

Paper No. HT2005-72364, pp. 205-212; 8 pages
  • ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
  • Heat Transfer: Volume 1
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4731-4 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Energy transport across solid-solid interfaces is a critical consideration in various micro- and nanoscale devices and structures. The impact of the thermal interface resistance is most pronounced at cryogenic temperatures. Heat conduction in Josephson junctions is analyzed to illustrate the significance of thermal interface engineering in the thermal management of superconducting devices. In nanolaminates and nanoscale thin films the thermal interface resistance plays a critical role even at elevated temperatures. Experimental studies using nanolaminates provide further insight into heat conduction across interfaces. An approximate theoretical model is presented to elucidate the effect of electron-phonon nonequilibrium on heat conduction across nanolaminates.

Copyright © 2005 by ASME



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